徐屾

发布者:唐子夏发布时间:2020-06-04浏览次数:6986

 


个人信息:

姓名:徐屾职称:教授

专业:机械工程  学历层次:博士

办公室地点:现代交通中心8B503

办公电话:67791430

电子邮箱:shxu16@sues.edu.cn

研究方向:多尺度热测量,热管理

主讲课程:热力学基础、汽车零部件制图测绘实验、工程数值方法及应用等


个人简介:(教育背景、工作经历)

教育经历:

2015年在美国爱荷华州立大学获得机械工程博士学位。主要从事多尺度能量输运理论和实验研究。

工作经历:

20169月入职yl7703永利官网车辆工程系;20201-12CSC国家公派访问学者;主持国家自然科学基金青年项目一项,上海市教委人才计划项目1项,参与科技部重点研发计划2项,国家自然科学基金面上项目1项,共发表SCI论文50余篇,发明专利1项,实用新型专利1项。

主要科研成果:代表性论文、专利、著作等)

代表性论文

(1)Mahya Rahbar, Ying Wang, Shen Xu, Wenlong Cheng, Xinwei Wang, Structural Effects on Thermal Conductivity of Micro-thick Li4Ti5O12-based Anode, Journal of Applied Physics, 2024, Vol. 135, 235102.

(2)Qusai Alahmad, Mahya Rahbar, Meng Han, Huan Lin, Shen Xu, Xinwei Wang, Thermal Conductivity of Gas Diffusion Layers of PEM Fuel Cells: Anisotropy and Effects of Structures, International Journal of Thermophysics, 2023, Vol. 44, 167.

(3)Amin Karamati, Shen Xu, Huan Lin, Mahya Rahbar, Xinwei Wang, Thermophysical Properties of 1D Materials: Transient Characterization down to Atomic Level, Journal of University of Science and Technology of China, 2023, 53(10): 1001.

(4)Shen Xu, Xinwei Wang, Stress Waves in Laser-material Interaction: from Atomistic Understanding to Nanoscale Characterization, Journal of Thermal Stresses, 2023,Vol. 46, No. 6, 464-491.

(5)Mahya Rahbar, Meng Han, Shen Xu, Hamidreza Zobeiri, Xinwei Wang, "Development of Differential Thermal Resistance Method for Thermal Conductivity Measurement Down to Microscale," International Journal of Heat and Mass Transfer, 2023,202, 123712.

(6)Shen Xu, Nicholas Hunter, Hamidreza Zobeiri, Huan Lin, Wenlong Cheng, and Xinwei Wang, "Distinct optical and acoustic phonon temperatures in nm-thick suspended WS2: direct differentiating via acoustic phonon thermal field invariant," Materials Today Physics, 2022, Vol. 27, 100816.

(7)Shen Xu, Hamidreza Zobeiri, Nicholas Hunter, Hengyun Zhang, Gyula Eres, Xinwei Wang, "Photocurrent in Carbon Nanotube Bundle: Graded Seebeck Coefficient Phenomenon," 2021, Nano Energy, Vol. 86, 106054.

(8)Shen Xu, Aoran Fan, Haidong Wang, Xing Zhang, and Xinwei Wang, Raman-based Nanoscale Thermal Transport Characterization: A Critical Review, International Journal of Heat and Mass Transfer, 2020, 154: 119751.

(9)Shen Xu, Jing Liu, and Xinwei Wang, 2020, Thermal Conductivity Enhancement of Polymers via Structure Tailoring (invited review), Journal of Enhanced Heat Transfer, 2020.

(10) Hamidreza Zobeiri, Shen Xu, Yanan Yue, Qianying Zhang, Yangsu Xie, Xinwei Wang, Effect of Temperature on Raman Intensity of nm-thick WS2: Combined Effects of Resonance Raman, Optical Properties, and Interface Optical Interference, Nanoscale, 2020, 12(10): 6064~6078.

(11) Ridong Wang, Tianyu Wang, Hamidreza Zobeiri, Pengyu Yuan, Cheng Deng,Yanan Yue, Shen Xu and Xinwei Wang, Measurement of the thermal conductivities ofsuspended MoS2 and MoSe2 by nanosecondET-Raman without temperature calibration andlaser absorption evaluation, Nanoscale, 2018,10(48): 23087~23102.

(12) Bowen Zhu; Jing Liu; Tianyu Wang; Meng Han; Shah Valloppilly; Shen Xu; Xinwei Wang,Novel Polyethylene Fibers of Very High Thermal Conductivity Enabled by Amorphous Restructuring, ACS Omega, 2017, 2(7): 3931~3944.

(13) Shen Xu, Tianyu Wang, David Hurley, Yanan Yue, Xinwei Wang, Development of time-domain differential Raman for transient thermal probing ofmaterials, Optics Express, 2015, 23(8): 10040-10056.

(14) Tianyu Wang, Shen Xu, David H. Hurley, Yanan Yue, Xinwei Wang*, Frequency-resolved Raman for transient thermal probing and thermal diffusivity measurement, Optics Letters, 2015, 41(1): 80-83.

(15) Shen Xu; Zaoli Xu; James Starrett; Cheryl Hayashi; Xinwei Wang, Cross-plane thermal transport in micrometer-thick spider silk films, Polymer, 2014.01.01, 55(7): 1845~1853.

(16) Shen Xu, Xinwei Wang*, Across-plane thermal characterization of films based on amplitude-frequency profile in photothermal techniqueAIP Advances2014, 4(10): 107122.

(17) Huan Lin, Shen Xu, Xinwei Wang*, Ning Mei, Significantly reduced thermal diffusivity of free-standing two-layer graphene in graphenefoam, Nanotechnology, 2013, 24(41): 415706.